혁신에 열정을 더하다

제품소개

  • Wafer
  • Photo resist
  • E-beam resist
  • Spin coater & Hot plate
  • WETSEM
  • Coming soon

고객센터

Home > 제품소개 > Positive photo resist

Positive photo resist

5. KL IR 15 Photoresist for Image Reversal (Lift Off and Vertical profile)
ㆍ  Image Reversal (positive and negative) photo resist
ㆍ  Bake 온도로 positive와 negative tone으로 변경
Version: undercut profile and vertical profile
ㆍ  Thickness: 1.2 μm - 2.5 μm in a single coat
Exposure: i-Line, g-Line and broadband
ㆍ  저렴한 가격. 0.5 L, 1 L, 4 L 이외 용량 선택 가능
ㆍ  납기일: 3~5주 (평균 납기일: 24일, 2018년 납품 기준)
KL IR15 Photoresist for Image Reversal (Lift Off and Vertical profile)
Description
Properties
 - KL IR 15 series image reversal photoresists are used as either
   positive and negative photoresist in i-line, g-line and broadband
   applications.
 - KL IR 15: Designed for straight profiles when used as negative
   photoresist.
 - KL IR Lift-Off 15: Designed for lift-off profiles when used as
   negative photoresist.
KL_IR_15_spin_curve.JPG

Positive Resist Mode
Negative (Vertical or Lift Off) Resist Mode
Softbake105 °C for 90 seconds
ExposureBroadband, i-lin, g-line
PEB115 °C for 60 seconds
Development0.26N TMAH
RemovalNMP / DMSO based strippers
Softbake105 °C for 90 seconds
ExposureBroadband, i-lin, g-line
Reversal Bake (critical step)130 °C for 120 seconds
Flood Exposure (non-critical)200 mJ/cm2 (broadband)
Development0.26N TMAH
Hardbake (optional)130 °C for 60 seconds
RemovalNMP / DMSO based strippers

Process results of KL IR Lift-Off 15
ExampleNegative tone Lift-Off ProcessExampleGold Deposition & Lift Off Process
Film Thickness1.5 micronsFilm Thickness of PR1.5 microns
Broadband exposure100 mJ/cm2Film Thickness of Gold150 nm
Develop time45 seconds puddle (recommended)Adhesion LayerTi
Results
KL_IR_neg_lift_off_1.jpg KL_IR_neg_lift_off_2.jpg

KL_IR_neg_lift_off_3.jpg
Results
(2, 3, 4 μm dense line/space after lift off)
KL_IR_neg_lift_off_4.jpg

KL_IR_neg_lift_off_5.jpg

KL_IR_neg_lift_off_6.jpg

Process results of KL IR 15
ExamplePositive tone ProcessNegative tone Process
Film Thickness1.5 microns1.5 microns
Broadband exposure~ 70 mJ/cm2120 mJ/cm2
Develop time60 seconds puddle (recommended)60 seconds puddle (recommended)
Results
KL_IR_pos_1.jpg KL_IR_pos.jpg

KL_IR_neg.jpg

Related Products (Guide for Kemlab Positive Photoresists)
Product Suite
Tone / Exposure
Product
Film Thickness (μm)
0.2
0.5
0.8
1
1.3
2
2.5
3
4
5
6
7
8
9
10
20
30
40
50
100
KL 5302 Hi-Res
  Interference Lithography (Link)  		Positive
  i-Line, Broadband, g-line  		KL 5302 Hi-Res                    
                    
KL 5300
General Purpose
(Link)		Positive
i-Line, Broadband, g-line		KL 5302                    
KL 5305                    
KL 5310                    
KL 5315                    
KL 6000
General Purpose Thick
(Link)		Positive
i-Line, Broadband, g-line		KL 6003                    
KL 6005                    
KL 6008                    
K-PRO
Packaging Resist (Link)		Positive
i-Line, Broadband, g-line		K-PRO 1                    
K-PRO 2                    
K-PRO 3                    
K-PRO 5                    
K-PRO 7                    
K-PRO 15                    
Related Products (Guide for Kemlab Neative Photoresists)
Product Suite
Tone / Exposure
Product
Film Thickness (μm)
0.20.50.811.322.534567891020304050100
HARE SQ
Negative Epoxy (Link)		Negative
Epoxy Resist
i-Line, Broadband
MEMS, Microfluidics		SQ 2                    
SQ 5                    
SQ 10                    
SQ 25                    
SQ 50                    
KL Image Reversal
Lift Off (Link)		Positive / Negative
i-Line, Broadband, g-line		KL IR Lift-Off 15                    
KL IR 15                    
APOL-LO 3200
  Negative Lift Off Profle (Link)		Negative undercut profile
i-Line, Broadband		APOL-LO 3202                    
APOL-LO 3204                    
APOL-LO 3207                    
KL NPR
  Vertical Profile (Link)		Negative vertical profile
i-Line and Broadband		KL NPR 1                    
KL NPR 2                    
KL NPR 4                    
KL NPR 6                    
KL NPR 10