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Positive photo resist

2. KL 7000 Photoresist for IC fabrication
ㆍ  PFAS-Free Positive Photo Resist
ㆍ  CD: 0.55 μm
Thickness: 0.15 μm - 2.5 μm
ㆍ  CD: 0.55 μm
Thickness: 0.15 μm - 2.5 μm
ㆍ  Application: IC fabrication, interference or holographic lithography, diffraction grating
ㆍ  Application: IC fabrication, interference or holographic lithography, diffraction grating
ㆍ  저렴한 가격. 0.5 L, 1 L, 4 L 이외 용량 선택 가능
ㆍ  저렴한 가격. 0.5 L, 1 L, 4 L 이외 용량 선택 가능
KL 7000 PFAS-Free Positive Photo Resist for IC fabrication
Description
Features
 - KL 7000 series are positive photoresists for use in i-line, g-line
  and broadband applications.
 - KL 7000 offers high sensitivity, and high throughput suitable for
  IC fabrication.
 - The KL7000 system is engineered to contain no PFAS and
  no Fluorine containing materials for environmental safety and
  demanding regulatory compliance.
 - Designed for use with industry standard MIF and MIB developers;
  optimized for 0.26N TMAH.
 - Achieve resolution 0.55 μm dense line/space and
  0.40 μm isolated line.
 - Competes with S1800™, AZ®1500, and other general use
  positive tone photoresist.		  - Tone: Positive.
 - Film Thickness: 0.15 - 3.0 μm.
 - Sensitivity: NUV, Broadband, i-line, h-line, g-line.
 - Developer: TMAH-based.
 - Remover: NMP, DMSO at 50–80 °C.
 - Products: KL 7002-TF, KL 7005, KL 7010, KL 7015, KL 7020.

Description
Product Film Thickness
Range (micorns)		 Softbake  Exposure
Broadband/NUV on Si		 Post Exposure Bake (PEB) Develop 0.26N TMAH Hardbake Recommended
 KL 7002-TF 0.15 - 0.30 μm 105°C
for 1 min		 50 mJ/cm2 115°C
for 1 min		 30 secs
immersion		 110°C
for 1 min
 KL 7005 0.4 - 1.0 μm 30 mJ/cm2
 KL 7010 0.7 - 1.5 μm 35 mJ/cm2
 KL 7015 1.2 - 2.5 μm 40 mJ/cm2
 KL 7020 1.5 - 3.0 μm 45 mJ/cm2

KL 7000  Series Thin Spin Curve
KL 7000  Series Thick Spin Curve
spin_curve.jpg
spin_curve1.jpg

Process results
1_5_um_FT.jpg
1.5 μm film thickness
0_55_um.JPG
CD: 0.55 μm
 
1_5_um_FT.jpg
    Exposure: 100 mJ i-line Stepper, NA=0.55
Products Guide
Tone
Product (link)
Film Thickness (µm)
Feature
Adhesion PromoterSurPassNAApply resist: Novolac, DNQ, PMMA, HSQ, PMGI, SU-8, SML, PI, ...
NegativeHARE SQ series2 – 100 and 200*Epoxy.
SQ QuickDry series2 – 200Epoxy, Quick drying solvent.
SQ MicroCoat series0.05 – 2Epoxy, Thin film, Surface protection.
SQ OptiCoat series2 – 100Epoxy, Higher transparency.
APOL-LO 3200 series2 – 10+Lift-off profile.
KL NPR series1 – 20Vertical profile.
Image ReversalKL IR 15,
KL IR Lift-Off 15		1.2 – 2.6Lift-off profile (negative),
Vertical profile (negative).
PositiveKL 7000 series0.15 – 3High resolution, No PFAS and Fluorine.
KL 6000 series2.5 – 11General thick purpose.
K-PRO series0.8 – 25 and 50*Plating and etch application.
Advanced packaging
Protective Surface CoatingPSC-10032.4 – 5.3Protective Surface Coating
PSC-IB DPM 101010 (@ 2000 RPM)Protective Surface Coating
* Double coating.