Home > 제품소개 > Positive ebeam resist
Features |
Properties | ||||||||||||||||||||||||||||||
- Positive Tone Resist - Very High Resolution: < 10 nm - Very High Aspect Ratio: < 10:1 @ 30 kV < 50:1 @ 100 kV - Slow Etch Rate - Thickness: 50 nm - 2000 nm - Superior contrast - Excellent surface adhesion (HMDS not required) |
|
Spin Curve
| |
|
Process results | |||
SML50: resolution 5 nm (thickness: 50 nm) |
SML300: resolution 33 nm (thickness: 400 nm) | ||
SML2000: resolution 29.5 nm (thickness: 1930 nm), aspect ratio: 65:1 |
SML600 - Aluminum features after metallisation: 58 nm wide, 500nm tall, aspect ratio: 8.6:1 |