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Positive photo resist

4. K-PRO Photoresist for Packaging Applications
ㆍ  Positive photo resist for packaging applications
ㆍ  Thickness: 1 μm - 25 μm (50 μm double coat)
ㆍ  Exposure: i-Line, g-Line and broadband
ㆍ  저렴한 가격. 0.5 L, 1 L, 4 L 이외 용량 선택 가능
ㆍ  납기일: 3~5주 (평균 납기일: 24일, 2018년 납품 기준)
K-PRO Photoresist for Packaging Applications
K-PRO
Description
Properties
 - K-PRO is a positive photoresist for use in i-Line, g-Line and
  broadband packaging applications.
 - Designed for plating, bumping, TSV, and other metal deposition
  processes.
 - Excellent substrate adhesion for wet etch applications.
 - Compatible with most plating metals and offer high sensitivity,
  steep wall profiles, high aspect ratios, increased heat resistance,
  and excellent process latitude. 		 - Tone: Positive
 - Film Thickness: 1 – 25 μm in a single coat (50 μm double coat)
 - Sensitivity: Broadband, i-line, g-line
 - Developer: TMAH-based, KOH-based
 - Remover: NMP, DMSO, etc

K-PRO 1, 2 and 3 Spin Curve
 
K-PRO 5, 7 and 15 Spin Curve
K-PRO 1, 2 and 3 Spin Curve
K-PRO 5, 7 and 15 Spin Curve

K-PRO Absorbance
 
K-PRO Optical Parameters
K-PRO Absorbance
K-PRO Optical Parameters

Process Guidelines
ProductFilm Thickness (μm)Soft Bake Rehydration Time Broadband Aligner Exposure
K-PRO 11115 °C for 2 min3 minutes65 mJ/cm2
K-PRO 22115 °C for 2 min3 minutes72 mJ/cm2
K-PRO 33115 °C for 2 min3 minutes76 mJ/cm2
K-PRO 54115 °C for 2.5 min5 minutes80 mJ/cm2
K-PRO 77115 °C for 3 min15 minutes125 mJ/cm2
K-PRO 1515
25		115 °C for 4 min
115 °C for 5.5 min		30 minutes
30 minutes		210 mJ/cm2
380 mJ/cm2
K-PRO 15 (Double Coat)50110 °C for 6 min
115 °C for 8 min		30 minutes800 mJ/cm2

Process results
KL_P4800_FT10.jpg
Copper: Photoresist strip - 10 μm Cu Post on Cu substrate
KL_P4800_FT15.jpg
Copper: Plated Cu on Cu substrateFilm Thickness 15 μm: 10 μm line/space 1:1
KL_P4800_TF25.jpg
Silicon:
Film Thickness 25 μm: 15 μm line/space
Copper_Plating_Application_5um_Cu_Posts_230x120.jpg
Copper Plating Applications: 5 μm Cu Posts
15um_film_7um_sl_230x120.jpg
15 μm film, 7 μm S/L
25um_film_10um_sl_230x120.jpg
25 μm film, 10 μm S/L
Products Guide for KemLab Inc.
Tone
Product (link)
Film Thickness (µm)
Feature
NegativeHARE SQ series2 – 100 and 200*Epoxy.
SQ QuickDry series2 – 200Epoxy, Quick drying solvent.
SQ MicroCoat series0.05 – 2Epoxy, Thin film, Surface protection.
SQ OptiCoat series2 – 100Epoxy, Higher transparency.
APOL-LO 3200 series2 – 10+Lift-off profile.
KL NPR series1 – 20Vertical profile.
Image ReversalKL IR 15,
KL IR Lift-Off 15		1.2 – 2.6Lift-off profile (negative),
Vertical profile (negative).
PositiveKL 7000 series0.15 – 3High resolution, No PFAS and Fluorine.
KL 6000 series2.5 – 11General thick purpose.
K-PRO series0.8 – 25 and 50*Plating and etch application.
Advanced packaging
Protective Surface CoatingPSC-10032.4 – 5.3Protective Surface Coating
PSC-IB DPM 101010 (@ 2000 RPM)Protective Surface Coating
* Double coating.