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Negative photo resist

9. XP 405nm NPR 2 - 405nm wavelength Negative Photoresist
ㆍ  405nm wavelength Negative Photoresist
ㆍ  Thickness: about 2 μm
ㆍ  1 L, 4 L, 16 L 이외 용량 선택 가능
ㆍ  납기일: 3 ~ 5 주 내외
XP 405nm NPR 2 - 405nm wavelength Negative Photoresist
Sample Description
Processing
 - Straight wall negative photoresist in KemLab Inc NPR photoresist series  modified for 405nm wavelength exposure.
 - Lithography: Images look excellent under microscope: using a mask, 1 micron lines resolved withvery little LER.		 - Coat: Spread Cycle: 5 sec spread cycle at 1000 rpm,   Spin Cycle: Accelerate at 1000 r/s to final spin speed for 45 seconds.
   - Soft-Bake: 110o C for 90 seconds (hotplate)
   - Exposure: Broadband contact exposure 300 mJ/cm2 at 405nm wavelength using 400nm  cutoff filter on silicon. Intensity @ 405 = 18.4 mW/cm2.
   - Dose will vary on different substrates & exposure tools. For single wavelength exposure tool,  we think it will need ~ 50% more dose, but we have no way to measure.
   - Post Exposure Bake: 110o C for 90 seconds (hotplate)
   - Develop: ~ 30 - 40 seconds: immersion in 0.26N TMAH developer
 - Film Thickness = 2.04 micron at 2000 rpm, Viscosity = 16 cst

  
Wavelength (nm)
XP 405nm NPR2 Wavelength.
Products Guide
                                                                            
Tone
Product (link)
Film Thickness (µm)
Feature
Adhesion PromoterSurPassNANovolac, DNQ, PMMA, HSQ, PMGI, SU-8, SML, PI, ...
NegativeHARE SQ series2 – 100 and 200*Epoxy.
SQ QuickDry series2 – 200Epoxy, Quick drying solvent.
SQ MicroCoat series0.05 – 2Epoxy, Thin film, Surface protection.
SQ OptiCoat series2 – 100Epoxy, Higher transparency.
APOL-LO 3200 series2 – 10+Lift-off profile.
KL NPR series1 – 20Vertical profile.
XP 405nm NPR 22405nm wavelength exposure, Vertical profile.
Image ReversalKL IR 15,
KL IR Lift-Off 15		1.2 – 2.6Lift-off profile (negative),
Vertical profile (negative).
PositiveKL 7000 series0.15 – 3High resolution, No PFAS and Fluorine.
KL 6000 series2.5 – 11General thick purpose.
K-PRO series0.8 – 25 and 50*Plating and etch application.
Advanced packaging
Protective Surface CoatingPSC-10032.4 – 5.3Protective Surface Coating
Conductive layerDisCharge H2OX480 – 170Improved Scanning Electron Microscope
Imaging on Non-Conductive Substrate
* Double coating.