혁신에 열정을 더하다

제품소개

  • Wafer
  • Photo resist
  • E-beam resist
  • Spin coater & Hot plate
  • WETSEM
  • Coming soon

고객센터

Home > 제품소개 > Positive photo resist

Positive photo resist

3. KL 6000 Thick photoresist
ㆍ  Positive photo resist High sensitivity and throughput
ㆍ  Application: Advanced packaging, TSV, Bumping, Plating
ㆍ  Thickness: 2.5 μm - 12 μm
Exposure: i-Line, g-Line and broadband
ㆍ  저렴한 가격. 0.5 L, 1 L, 4 L 이외 용량 선택 가능
ㆍ  납기일: 3~5주 (평균 납기일: 24일, 2018년 납품 기준)
KL 6000 Thick positive photo resist
Description
Properties
 - KL6000 is a positive photoresist for use in i-Line, g-Line and
   broadband applications.
 - KL6000 offers high sensitivity, high throughput, and excellent
   process latitude.
 - Application: Advanced packaging, TSV, Bumping, Plating.		  - Cover 2.5 – 12 microns in a single coat.
 - Designed for use with industry standard 0.26 N TMAH
   developers.
  - No PEB necessary.

KL 6000 Spin Curve
Film Thickness Range
KL 6000 Positive Photo Resist Spin curve.
Product microns Viscosity (cst)
KL 6008 5 - 12+ 210
KL 6005 4 - 7 98
KL 6003 2.5 - 4.5 45

Process Guide
Product:
Film Thickness		 KL 6008
11 μm		 KL 6008
8 μm		 KL 6005
5 μm		 KL 6003
3 μm
Softbake 105 °C for 150 sec 105 °C for 150 sec 105 °C for 120 sec 105 °C for 90 sec
Expose (broadband) on Si 210 mJ/cm2 180 mJ/cm2 120 mJ/cm2 90 mJ/cm2
Post Exposure Bake (optional) 65 °C for 1 min
95 °C for 1 min		 65 °C for 1 min
95 °C for 1 min		 65 °C for 2 min
95 °C for 2 min		 65 °C for 3 min
  95 °C for 3 min
Develop double spray puddle,
each 90 sec		 double spray puddle,
each 75 sec		 double spray puddle,
each 45 sec		 single spray puddle,
60 sec
Boradband Exposure
KL 6008 Positive Photo Resist Boradband exposure 3 micron lines at film thickness 11 micron
3 micron lines
KL 6008 Positive Photo Resist Boradband exposure 3 micron lines at film thickness 8 micron
3 micron lines
KL 6005 Positive Photo Resist Boradband exposure 2 micron lines at film thickness 5 micron
 2 micron lines
KL 6003 Positive Photo Resist Boradband exposure 1 micron lines at film thickness 3 micron
1 micron lines

Process results
KL 6000 Positive Photo Resist Process result 2 micron lines at 4 micron film thickness
2 μm line @ 4 μm film thickness
KL 6000 Positive Photo Resist Process result 3 micron lines at 4 micron film thickness
3 μm line @ 4 μm film thickness
Products Guide
Tone
Product (link)
Film Thickness (µm)
Feature
Adhesion PromoterSurPassNANovolac, DNQ, PMMA, HSQ, PMGI, SU-8, SML, PI, ...
NegativeHARE SQ series2 – 100 and 200*Epoxy.
SQ QuickDry series2 – 200Epoxy, Quick drying solvent.
SQ MicroCoat series0.05 – 2Epoxy, Thin film, Surface protection.
SQ OptiCoat series2 – 100Epoxy, Higher transparency.
APOL-LO 3200 series2 – 10+Lift-off profile.
KL NPR series1 – 20Vertical profile.
Image ReversalKL IR 15,
KL IR Lift-Off 15		1.2 – 2.6Lift-off profile (negative),
Vertical profile (negative).
PositiveKL 7000 series0.15 – 3High resolution, No PFAS and Fluorine.
KL 6000 series2.5 – 11General thick purpose.
K-PRO series0.8 – 25 and 50*Plating and etch application.
Advanced packaging
Protective Surface CoatingPSC-1003, PSC-10102.4 – 5.3, 10Protective Surface Coating
PSC-IB DPM 101010 (@ 2000 RPM)Protective Surface Coating
* Double coating.