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Positive photo resist

3. KL 6000 Thick photoresist
ㆍ  Positive photo resist High sensitivity and throughput
ㆍ  Application: Advanced packaging, TSV, Bumping, Plating
ㆍ  Thickness: 2.5 μm - 12 μm
Exposure: i-Line, g-Line and broadband
ㆍ  저렴한 가격. 0.5 L, 1 L, 4 L 이외 용량 선택 가능
ㆍ  납기일: 3~5주 (평균 납기일: 24일, 2018년 납품 기준)
KL 6000 Thick positive photo resist
Description
Properties
 - KL6000 is a positive photoresist for use in i-Line, g-Line and
   broadband applications.
 - KL6000 offers high sensitivity, high throughput, and excellent
   process latitude.
 - Application: Advanced packaging, TSV, Bumping, Plating.		  - Cover 2.5 – 12 microns in a single coat.
 - Designed for use with industry standard 0.26 N TMAH
   developers.
  - No PEB necessary.

KL 6000 Spin Curve
Film Thickness Range
KL 6000 Positive Photo Resist Spin curve.
Product microns Viscosity (cst)
KL 6008 5 - 12+ 210
KL 6005 4 - 7 98
KL 6003 2.5 - 4.5 45

Process Guide
Product:
Film Thickness		 KL 6008
11 μm		 KL 6008
8 μm		 KL 6005
5 μm		 KL 6003
3 μm
Softbake 105 °C for 150 sec 105 °C for 150 sec 105 °C for 120 sec 105 °C for 90 sec
Expose (broadband) on Si 210 mJ/cm2 180 mJ/cm2 120 mJ/cm2 90 mJ/cm2
Post Exposure Bake (optional) 65 °C for 1 min
95 °C for 1 min		 65 °C for 1 min
95 °C for 1 min		 65 °C for 2 min
95 °C for 2 min		 65 °C for 3 min
  95 °C for 3 min
Develop double spray puddle,
each 90 sec		 double spray puddle,
each 75 sec		 double spray puddle,
each 45 sec		 single spray puddle,
60 sec
Boradband Exposure
KL 6008 Positive Photo Resist Boradband exposure 3 micron lines at film thickness 11 micron
3 micron lines
KL 6008 Positive Photo Resist Boradband exposure 3 micron lines at film thickness 8 micron
3 micron lines
KL 6005 Positive Photo Resist Boradband exposure 2 micron lines at film thickness 5 micron
 2 micron lines
KL 6003 Positive Photo Resist Boradband exposure 1 micron lines at film thickness 3 micron
1 micron lines

Process results
KL 6000 Positive Photo Resist Process result 2 micron lines at 4 micron film thickness
2 μm line @ 4 μm film thickness
KL 6000 Positive Photo Resist Process result 3 micron lines at 4 micron film thickness
3 μm line @ 4 μm film thickness
Related Products (Guide for Kemlab Positive Photoresists)
Product Suite
Tone / Exposure
Product
Film Thickness (μm)
0.2
0.5
0.8
1
1.3
2
2.5
3
4
5
6
7
8
9
10
20
30
40
50
100
KL 5302 Hi-Res
  Interference Lithography (Link)  		Positive
  i-Line, Broadband, g-line  		KL 5302 Hi-Res                    
                    
KL 5300
General Purpose
(Link)		Positive
i-Line, Broadband, g-line		KL 5302                    
KL 5305                    
KL 5310                    
KL 5315                    
KL 6000
General Purpose Thick
(Link)		Positive
i-Line, Broadband, g-line		KL 6003                    
KL 6005                    
KL 6008                    
K-PRO
Packaging Resist (Link)		Positive
i-Line, Broadband, g-line		K-PRO 1                    
K-PRO 2                    
K-PRO 3                    
K-PRO 5                    
K-PRO 7                    
K-PRO 15                    
Related Products (Guide for Kemlab Neative Photoresists)
Product Suite
Tone / Exposure
Product
Film Thickness (μm)
0.20.50.811.322.534567891020304050100
HARE SQ
Negative Epoxy (Link)		Negative
Epoxy Resist
i-Line, Broadband
MEMS, Microfluidics		SQ 2                    
SQ 5                    
SQ 10                    
SQ 25                    
SQ 50                    
KL Image Reversal
Lift Off (Link)		Positive / Negative
i-Line, Broadband, g-line		KL IR Lift-Off 15                    
KL IR 15                    
APOL-LO 3200
  Negative Lift Off Profle (Link)		Negative undercut profile
i-Line, Broadband		APOL-LO 3202                    
APOL-LO 3204                    
APOL-LO 3207                    
KL NPR
  Vertical Profile (Link)		Negative vertical profile
i-Line and Broadband		KL NPR 1                    
KL NPR 2                    
KL NPR 4                    
KL NPR 6                    
KL NPR 10